Micron 300W Handheld Hot Air SMD Rework Gun with SOIC-CHIP-QFP-PLCC& BGA devices

This 300W hot air handheld SMD Rework tool provides a quick and easy way to rework boards fitted with surface mount parts, including RoHS certified products. It works by blowing 300 watts of heated air onto the board your are working on, melting the solder on the SMD?pads in the process. The nozzles are single pipe in 8.5Ø, 6.5Ø, 5Ømm diameter, suitable for use with SOIC, CHIP, QFP, PLCC & BGA devices and a wide variety of SMD components. Supplied metal with safety stand. are single pipe in 8.5Ø, 6.5Ø, 5Ømm diametres, suitable for use with SOIC, CHIP, QFP, PLCC & BGA devices and a wide variety of SMD components.

• Low vibration air pump
• 22 litres per minute air flow
• Adjustable air flow and temperature
• Rubberised hand grip
• Suits leaded &?lead free solder (RoHS)
• Convenient handheld all in one design
• Rapid heat up
• LCD temperature display
• Includes 3 nozzles (12Ø, 8Ø, 5Ømm)
• Power: 300W
• Voltage: 220-240V AC 50Hz
• Hot air temperature: 200-500°C
• Hot air capacity: 22L/Minute (Max)